When a plastic bottle was produced by a hollow blow molding machine, it was found that the cap did not function as a burglarproof, but was caused by a large diameter of the burglar ring at the mouth of the bottle. The reason why the diameter of the anti-theft ring is too large is directly caused by the large diameter of the anti-theft groove on the mold. Find out the crux of the problem, the usual method is to re-mold the mold. At the same time, it takes a certain amount of time to re-make the mold, which will inevitably affect the entire production cycle. In response to this situation, we decided to use bonding technology to repair the mold; the specific steps are as follows:
(l) Firstly, 0.1 thick copper foil is cut into two strips with scissors. The width of the strip is slightly smaller than the width of the anti-theft groove on the mold to facilitate bonding; the length of the strip is equal to the circumference of the anti-theft slot. One part; (2) use a cotton swab to rub a little gasoline, wipe the anti-theft groove on the mold and the front and back of the copper foil; (3) mix the two components of the modified epoxy resin adhesive in proportion, and evenly apply it on the copper foil. On the bonding surface, it should be noted that the adhesive layer is not too thick, otherwise the adhesive will be squeezed out from the gap between the copper foil and the anti-theft groove during the pressure curing process, which will eventually affect the geometry of the anti-theft ring on the bottle mouth. In case of seriousness, the mold repair work may even fail; (4) a standard plastic bottle is placed in the mold, and then the mold is clamped to cure the adhesive under pressure for 4 hours; (5) after the adhesive is cured, it should be tried first. A number of plastic bottles, after the products to be tested are qualified, can be officially mass-produced plastic bottles.
Practice has proved that the proper use of the bonding process to repair the mold is simple, easy, economical, and highly reliable. Moreover, since the mold does not need to be disassembled during repair, the mold release, mold loading and mold time are saved. , greatly reducing the loss of downtime, so that the repaired mold can be quickly put into normal use, creating more and better economic benefits for the enterprise.
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Label: Analysis of bonding technology to repair molds
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